AI datacenters will be powered by
multi-color lights
AI datacenter bandwidth is doubling every two years, pushing networks beyond the limits of electrical interconnects.
The industry is turning to optical interconnects - enabled by silicon photonics and co-packaged optics (CPO) - to keep up.
At the heart of this shift are multi-color laser light sources, which make high-bandwidth, scalable optical connectivity possible.
We remove the final barrier to scalable photonics
Photon Bridge technology unlocks orders-of-magnitude improvements in manufacturability, power, and testability.
Manufacturability
— 100x faster assembly
Testability
— 100x larger silicon waveguide,
enabling >2W power handling
Power-handling
— Rapid, straightforward testing
— No need for specialized alignment
equipment
We move photonic integration from the wafer fab to scalable packaging
By combining III–V light sources with thick silicon waveguides, our cantilever platform delivers stable, manufacturable photonics through OSAT-based integration.
With 25× lower wavelength variation, passive devices operate with little to no active tuning, reducing power, complexity, and cost.
Unlimited optical IOs
Any material combination
Simplified thermal controls
AI Data-centers
— Multi-wavelength light sources at scale
— Dense optical engines for AI data centers and co-packaged optics, where bandwidth, efficiency, and volume matter most
— Scaling connecting 10’s of GPUs today to 1000’s GPUs tomorrow
Physical AI
— Multi-wavelength light sources on a single siilicon platofrm
— Delivering range, resolution and environmental robustness
— Scalable and precise Photonic engines for sensing, robotics, and physical AI—applications where signal integrity and accuracy are critical
