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Digital light engines 
for the AI century 

Redefining photonic integration to make light scalable, manufacturable, and infrastructure-ready.​

Our digital light engines deliver higher output powers, smaller form-factors, broader bandwidth, and higher reliability - unlocking the next generation of AI data-center and sensing performance.​

Optical Power

>2x higher​

Form Factor

>10x smaller​

Power Density

>2x lower​

Photon Bridge Light Source

AI datacenters will be powered by
multi-color lights

 

AI datacenter bandwidth is doubling every two years, pushing networks beyond the limits of electrical interconnects.

The industry is turning to optical interconnects - enabled by silicon photonics and co-packaged optics (CPO) - to keep up.

At the heart of this shift are multi-color laser light sources, which make high-bandwidth, scalable optical connectivity possible.

We remove the final barrier to scalable photonics

Photon Bridge technology unlocks orders-of-magnitude improvements in manufacturability, power, and testability.

Manufacturability

Manufacturability

​

— 100x faster bonding

Testability

Testability

Power Handling

Power-handling

​

—  Rapid, straightforward testing
—  No need for specialized alignment
      equipment

​

— 50x larger silicon waveguide,
enabling >1W power handling

We move photonic integration from the wafer fab to scalable packaging

​

By combining III–V light sources with thick silicon waveguides, our cantilever platform delivers stable, manufacturable photonics through OSAT-based integration.

Our cantilever platform delivers <200 nm alignment accuracy at optical I/Os during high-speed (>2 µm) flip-chip bonding, unlocking unlimited I/Os per device and support for any III-V material system.​
With 25× lower wavelength variation, passive devices operate with little to no active tuning, reducing power, complexity, and cost.​

Photon Bridge Wafer
Unlimited IOs

Unlimited optical IOs

Material Combination

Any material combination

Photonics Laser Grating

Simplified thermal controls

Applications


We bridge the gap between high-density silicon photonics and the physical world. By delivering high-power, multi-color laser sources, on silicon, we enable next-generation computing, lidar, and sensing solutions. 

Photon Bridge ELS
AI GPU
Photon Bridge logo

Co-Packaged Optics
(CPO)

External Laser

Sources​

LIDAR & Spectral

Sensing

LIDAR & Spectral  Sensing
Next Gen AI Datacenter

Connecting the hyperscalers

—  Ultra compact CPO/NPO​

​

—  High bandwidth density                  10’s Tbps/mm

Connecting the physical 

—  Light source infrastructure &        sensing​

 

—  ​​High-power laser integration,​

      with low-cost manufacturing​​​

Physical AI

Latest news

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14 July 2026

Photon Bridge makes laser manufacturing LEGO-simple

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7 July 2026

Photon Bridge wins Gerard & Anton Award 2026

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20 May 2026

OPTICA OIM Enabling High-Volume Photonic Integration through Advanced Packaging

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